Revie

Lam Research’s Flex family is a dielectric etch platform used to form highly controlled structures in insulating materials across memory, logic, packaging and other semiconductor applications.

Oracle Exadata is engineered infrastructure for Oracle Database, combining database servers, intelligent storage, high-speed networking and database-aware software optimisations.

Palantir Apollo is the software-delivery and operations layer Palantir uses to deploy and manage software across cloud, on-premises and more constrained or disconnected environments.

Cisco Catalyst 9300 Series switches are stackable enterprise access switches with models spanning standard Gigabit access through multigigabit, high-power PoE and faster uplink configurations.

Intel Core Ultra 200HX processors are high-power mobile chips for performance laptops, using a hybrid mix of performance and efficiency cores with a 55W base-power class on major configurations.

ASML’s TWINSCAN NXE:3800E is a 0.33 NA EUV lithography system designed for high-volume production of leading-edge logic and DRAM, with a strong focus on throughput, imaging and overlay.

AMD Ryzen 9000 desktop processors use the Zen 5 architecture on AM5, with mainstream models spanning six to 16 CPU cores and support for DDR5 and PCIe 5.0.

SK hynix DDR5 memory targets servers, PCs and other modern computing platforms with higher transfer rates, greater density potential and improved power-management characteristics compared with DDR4.

Micron GDDR7 is next-generation graphics memory designed for GPUs and accelerators, using PAM3 signalling to increase data rate while adding efficiency and reliability improvements over older GDDR generations.