Soitec through the years: building engineered semiconductor substrates

Soitec was founded in France in 1992 by engineers André-Jacques Auberton-Hervé and Jean-Michel Lamure to commercialise advanced semiconductor substrate technology.

How Soitec developed

The company became closely associated with Smart Cut, a process used to create silicon-on-insulator wafers and other engineered substrates. It expanded into materials for radio-frequency, power, photonics and mobile applications as chipmakers adopted specialised substrate structures.

Soitec in 2026

By 2026, Soitec supplied engineered semiconductor substrates used by chip manufacturers in communications, automotive, industrial and computing markets.

Soitec’s history shows that innovation in semiconductors is not limited to transistor design: changing the wafer material beneath a chip can improve power, radio or performance characteristics.

Information was checked against public company material, regulatory filings and reputable independent reporting where available, using sources accessible on 18 September 2026.